CVE-2021-1979

Severity CVSS v4.0:
Pending analysis
Type:
CWE-787 Out-of-bounds Write
Publication date:
12/11/2021
Last modified:
16/11/2021

Description

Possible buffer overflow due to improper validation of FTM command payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile

Vulnerable products and versions

CPE From Up to
cpe:2.3:o:qualcomm:aqt1000_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:aqt1000:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:ar8035_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:ar8035:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:csrb31024_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:csrb31024:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fsm10055_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:fsm10055:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:fsm10056_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:fsm10056:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9150_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9150:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9250_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:qualcomm:mdm9250:-:*:*:*:*:*:*:*
cpe:2.3:o:qualcomm:mdm9650_firmware:-:*:*:*:*:*:*:*